YAXUN YX-535 20ML
Epoxy Glue Remover for Iphone/samsung , CellPhone/Computer chip clean BGA IC adhesive removing liquid.
Instructions: Applicable to softening and removing the mobile phone BGA IC chips and mainboard resin sealants. This product use new eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobile phone circuit boards or elements.
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