BGA-IC Remover – kaisi

BGA IC Epoxy Glue Remover for Iphone/samsung , CellPhone/Computer chip clean BGA IC adhesive removing liquid.

Instructions

     Applicable to softening and removing the mobile phone BGA IC chips and mainboard resin sealants. This product use new eco-friendly  that can rapidly soften and loosen the cured  phenolic aldehyde,epoxy,acrylic,polyurethane,silicone  resin sealants. It causes no damage to mobile phone circuit boards or elements.